Adax slashes the costs of high density I/O for ATCA

3 November 2009, MicroTCA Conference, Munich – Adax, a provider of high performance signaling infrastructure, has announced a solution to address the costs of providing high density I/O configurations in ATCA architecture. Using a combination of the AdaxPacketRunner (APR), Adax HDC3-AMC and Adax RemDevIO software, Adax is able to provide a cost saving of up to 30 per cent for high density SS7 links.

The Adax solution provides four Adax HDC3-AMCs on the APR ATCA blade, with the Adax RemDevIO allowing host processor applications to access remote signaling resources. This combination of products delivers a high level of SS7 signaling density at a lower price compared to an equivalent solution using four ATCA SBCs with one HDC3-AMC on each blade. This also reduces the system footprint by only taking up a single slot in the ATCA chassis, reducing congestion at the Central Office for operators with large subscriber bases that want to maximise the space they already have. This combination of Adax hardware and software allows telecommunications operators to deploy high-density, multi-purpose I/O applications such as Signaling Gateways and Home Location Registers (HLR) without the costs typically associated with high-density SS7 links for ATCA.

“The HDC3-AMC provides one of the highest densities on the market today, making it ideal for demanding telecommunications applications with high capacity and throughput requirements,” explains Robin Kent, director of European operations, Adax. “The Adax solution dramatically improves the value for money of every I/O link and, thanks to horizontal scaling, multiple APRs can be used in an ATCA chassis, providing users with virtually unlimited I/O resources.”

The APR provides a combination of scalability and access to host processing power at a viable price point supporting IP-transport, packet processing and signaling on one blade without the need for a general CPU or ProcessorAMC. The four AMC bays on the APR allow telecommunications operators to make the most of the high link density of the Adax HDC3-AMC, a purpose built AMC SS7 signaling board. These can provide a complete I/O subsystem when combined with the Adax RemDevIO, allowing applications on the host processor to access remote I/O resources on the APR as if they were local to the application.

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