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ATMIII-AMC

Overview
The ATMIII-AMC card is a high performance Advanced Mezzanine Controller designed for use in all aspects of telecommunications networks. With support for AAL2 and AAL5, the ATMIII-AMC has the capability for real-time voice and video over AAL2, as well as signaling and IP over AAL5 in 3G networks. The ATMIII-AMC is ideal for demanding carrier applications in Wireless 2G, 3G, IMS, Internet access, Fixed/Mobile Convergence and Next Generation Networks such as:

• 3G RNC, MSC, SGSN, and Node B
• Voice over Packet
• Video Streaming
• Broadband Networks
• ATM to IP Gateways

The ATMIII-AMC enables development flexibility in building next generation infrastructure and can be configured in many ways depending on customer specifications and preferred architecture. In addition, the AMC form factor provides enhanced performance and reliability. One or two ATMIII-AMCs, integrated with an AMC/SBC, can be configured as a signaling blade, housing complete ATM/IP gateways and offering one of the highest density, single slot solutions available on the market today. Alternatively, up to four AMC modules can be mounted with an AdvancedTCA carrier card for a high density ATCA signaling blade. This flexibility enables integrators to satisfy a wide range of requirements with a single common core architecture, saving development time and allowing customers to integrate their solutions ahead of the competition.

Features

• Four software selectable trunks of full E1/T1 (64 kbps), compliant to G.703/G.704 per card
• ATM AAL2 & AAL5 on a single trunk
• Virtual Circuits (VCs) for AAL5 termination
• 64000 VC for AAL2 switching at full rate between ports
• IP version 4 and 6 (future release)
• Transparent field upgrades, without host rebooting, saving downtime
• Multiple cards per system providing highly flexible and completely scalable solutions
• State of the Art Network Processor
• On-board 64 bit RISC Processor Core
• Utopia L2, Gigabit Ethernet and PCIe Bus to Carrier
• On-board Switching
• 384 MB SDRAM
• 16 MB Flash EPROM
• On-board IP to AAL2, AAL5 Interworking
• Bandwidth allocation of multiple 64 Kbps channels to create fractional T1/E1 links
• IPMI subsystem provides ATCA/AMC.0 hot swap and board management services
• Optional High Impendence Monitoring Configuration
• User-configurable support for Frame/MSU Time-Stamping
• 8 KHz Tx and Rx Ref. Clock
• SFP Optical Transceivers
• Solaris, Linux, and VxWorks drivers
• Backwardly compatible APIs
• SAAL software; SSCOP, SSCF/SSCS and SSSAR/SSTED/SSADT.
• Comprehensive alarms and status reporting capabilities.

ATM

• AAL2 & AAL5
• ATM cell switching
• AAL2 CID switching
• Traffic management as per TM 4.1: CBR, VBR, GFR and UBR
• Per VC queueing
• Dual leaky bucket policing
• Full UNI/NNI VPI/VCI range
• OAM F4 and F5 as per ITU-T I.610

Interworking

• IP routing and forwarding over ATM (RFC 1483/2684/1577)
• IP routing and forwarding over PPP (RFC 1661)
• Multiple fields classification and DiffServ (RFC 2474/2475)
• MPLS tagging/detagging
• L2 interworking between ATM and Ethernet
• Header compression (RFC 2507/2508/2509)
• AAL2 to UDP/IP interworking (CPS and SSSAR)
• AAL5 to UDP/IP interworking

IP

• IPv4 and IPv6 (IPv6: future release)
• PPP support
• Parsing of PPP over HDLC frames (RFC 2615 and RFC 1662)
• Packet scheduling

Application Overview

The ATMIII-AMC is the ideal solution for wireless networks because it accommodates different types of system architectures depending on customer requirements. The flexibility of the ATMIII-AMC results in a high performance, cost-effective solution that reduces time to market by minimizing customer development time and costs.

The ATMIII-AMC offers several different architecture options. Up to four ATMIII-AMC modules can be mounted on a carrier card with communication across the bus interface to the CPU or other AMC cards. Alternatively, they can be combined with an AMC/SBC to create a self-contained signaling blade in service of the main application. Ultimately, the ATMIII-AMC can be configured as a broadband signalling solution on a card.

The ATMIII-AMC can be implemented throughout UMTS/3G network nodes, offering unparalleled flexibility for building SGSNs, MSCs, RNCs and Node-Bs, and making it the ideal solution for developers building crucial 3G infrastructure.

Serving GPRS Support Nodes (SGSN) and Mobile Switching Centers (MSC)

The ATMIII-AMC can sit beneath all the signaling protocol stacks in the SGSN and MSC in a UMTS network, with support for a variety of protocols simultaneously on the card. The Radio Access Network Application Part is the Radio Access Layer for the Iu Interface and is found in both the SGSN and MSC. Here, integration is at the MTP3b and M3UA level via SSCOP/SSCF and SCTP respectively. SSCOP/SSCF runs over AAL5 on the Adax ATM card. The GPRS Tunneling Protocol (GTP) in the SGSN runs over IP over Ethernet, and over AAL5 over ATM using Adax Frame Relay. GTP is supported by the Ga, Gn and Gp interfaces, which interconnect the SGSN to the GGSN and charging gateways.

Radio Network Controllers (RNC)

The ATMIII-AMC supports both the Iu-PS and Iu-CS interfaces for which RANAP is the Radio Network Layer signaling protocol. As described above, Adax can fully support the RANAP stack using AAL5. In addition, the Iu-CS requires AAL2 transport, and the ATMIII-AMC can support the passing of AAL2 multiplexed traffic. The ATMIII-AMC provides the ideal solution for any customer requiring 3G signaling.

Node-B

With support for AAL2, AAL5 and interworking between AAL2/5 and UDP/IP, the ATMIII-AMC provides high performance signaling and data transfer for the Node-B in UMTS networks. The Adax SSCOP/SSCF/AAL5 links transfer the control plane traffic, while the AAL2 subchannel with interworking feature transfers and routes the realtime user plane traffic. Consequently, the ATMIII-AMC can be deployed within every UMTS network node, from the edge of the Radio Network Subsystem right through into the heart of the Core Network. The ATMIII-AMC supports IMA for T1/E1. By splitting the ATM cells and sending them across T1/E1 lines from the RNC and reassembling them at the Node-B, this allows existing T1/E1 lines to be utilized while still benefiting from the higher bandwidth of broadband signaling.

Single Board Signaling Gateway

The commonality of software between Adax products means that the ATMIII-AMC can be used to migrate narrowband SS7/IP signaling gateways to broadband solutions with minimal change in higher layers. This commonality not only protects the customer’s investment in higher layer software and design time, but also enables the customer to quickly and seamlessly utilize the higher bandwidth of broadband ATM solutions. Adax has a complete set of solutions for next generation network infrastructure in a compact, reliable and scalable format using the ATMIII-AMC cards, which can be configured according to a customer’s preferred architecture.

Technical Specifications

Protocol Support

• ATM AAL2, ITU-T I.363.2
• ATM AAL5, ITU-T I.363.5
• SSCOP, Q.2110
• SSCF NNI, Q.2140
• SSCF at UNI per Q.2130
• SSCS Layer Management, Q.2144
• SSSAR/SSTED/SSADT, ITU-T I.366.1
• HSL over AAL5, Telcordia GR-2878-Core

AMC System Interconnect

• PCI Express:
  • One x4 PCI Express Interface
  • AMC fat pipes region port 4-7 (root complex)

• Gigabit Ethernet:
  • Two Gigabit Ethernet 1000Base-BX (SerDes) ports
  • AMC common options region port 0-1.

Front Panel Interfaces

• LEDs:
  • Standard AMC
  • LED 0 (blue) Hot Swap
  • LED 1 (amber)
  • Four trunk status LEDs
  • One board status LED

Interface

• Four T1/E1 (Software Selectable)
• T1: ANSI T1.102, T1.403, AT&T TR62-411 Bellcore TR-TSY-000170
• E1: ITU G.703, G.704 and G.705 including CRC4, ETSI TBR 12 and 13

Power Requirements

• Nominally 1.25 Amps at 12V dc
• Maximum 1.5 Amps at 12V dc

Compliancy

• PICMG AMC.0 Advanced Mezzanine Card Specification R1.0
• PICMG AMC.1 PCI Express and Advanced Switching R1.0
• PICMG AMC.2 Gigabit Ethernet R1.x
• PICMG AMC.3 Storage Interfaces R1.x
• IPMI Intelligent Platform Management Interface Specifications, V1.5

Designed to meet:

• EMC Directive 89/336/EEC, EN 55022, EN55024 (Europe)
• EN 300 386
• FCC 47 CFR Part 15, Subpart B (USA)
• CISPR22
• VCCI (Voluntary Japan Electromagnetic Compatibility requirement)
• UL 60950, 3rd edition (US and Canada)
• LVD 73/23EEC (Europe)
• Denen Law (Japan Safety)

Quality

Adax manufacturing Quality Assurance is approved in accordance with the provisions of EC Council Directive 91/263/EEC.
Adax Europe Limited is an ISO 9001:2000 registered company

Temperature Range

-5° to +55°C

Board Dimensions

Full height 181.5 mm x 73.5 mm

All specifications are subject to change without notice.