Home > Products > Protocol Controllers > HDC > HDCIII PMC, AMC, PCI/X and PCIe

HDCIII - PMC, AMC, PCI/X and PCIe

Overview

The HDCIII is the latest generation of the highly successful Adax SS7 controller and is the first to offer up to 8 T1, E1 or J1 trunks per card. Specifically designed to meet the demands of wireline, wireless and NGN convergence platforms, the HDCIII excels at SS7 and provides a high density high performance solution for narrowband signaling applications.

Delivering up to 248 MTP2 links or 8 HSLs per card, the HDCIII provides one of the highest densities on the market today, making it ideal for demanding telecommunications applications with high capacity and throughput requirements. The onboard processor performs many thousands of transactions per second, with minimal load on the host, maximizing the performance of the applications and reducing system costs without compromising reliability.

The HDCIII is available in PMC, AMC, PCI/X and PCIe form factors, all of which share a common software driver and have a consistent API for application portability. This makes the HDCIII card a highly flexible, scalable and portable signaling solution for all system architectures that maximizes protection of investment.

The board is dynamically configurable and can deliver up to 256 channels of multiple protocols, including SS7 MTP2, LAPB/D/V5, Frame Relay, X.25 and HDLC per card. With the ability to install multiple cards in a system, the HDCIII provides a totally scalable, flexible and cost-effective solution that is ideal for any signaling node.

The HDCIII controller card offers unparalleled reliability and excellent price performance ratios. The HDCIII allows customers to satisfy a wide range of requirements with common core architecture, a single software driver, and a common API, saving development time, and providing fast time to market and rapid return on investment.

Features

• 8 software selectable trunks of full E1, T1, or J1 per card
• PMC, AMC, PCI/X and PCIe board formats
• 2, 4 and 8 trunk card options available
• Up to 248 LSL MTP2 links per card with high line utilization
• Up to 8 HSL MTP2 links per card
• On board processor and STREAMS environment for local MTP2 protocol execution, reduces CPU overhead and maximizes performance
• Optional support for broadband SS7 ATM AAL5
• Support for up to 256 channels of one or a combination of protocols on one card, including Frame Relay, HDLC, X.25, LAPB/D/F/V5
• Dynamically configurable per port and per channel protocol assignment
• Support for M3UA, M2PA, SCTP and M2UA
• Single HDCIII driver supports PCI/PCI-X, PCIe, PMC and AMC form factors, so applications run unchanged across all architectures
• Compatible with existing Adax APIs for all previous generation HDC boards
• Supports PCM voice traffic (future release)
• User configurable support for Drop and Insert to separate content from signaling
• Transparent field upgrades without host rebooting, saving downtime
• IPMI subsystem provides ATCA/AMC.0 hot swap and board management services (AMC version only)
• Designed to operate in master, slave, or transparent clocking modes
• High Impedance Monitoring Ports option
• User configurable support for Frame Time-Stamping
• User configurable support for FISU Filtering for monitoring SS7 traffic
• Red, Yellow and AIS alarm detection and externally visible trunk status LEDs
• Support for MTP2 PCR and BEC error correction
• Provides diagnostic, line loopbacks, and per DSO loopbacks
• Software Drivers for Linux, Solaris X.86 and Solaris SPARC as standard. Other OS support on request

Application Overview
The HDCIII enables development flexibility in Next Generation infrastructure, and can be configured in many ways, depending on customer specification and their preferred system architecture. This flexibility enables integrators to satisfy a wide range of requirements with a single common core architecture, saving development time and allowing customers to integrate their solutions ahead of competition.

Up to four HDCIII modules can be mounted on a carrier card with communication across the bus interface to the CPU or other cards. Alternatively, they can be combined with an SBC to create a self-contained signaling blade in service of the main application. The ultimate capability of four HDCIII modules on an ATCA board is to host a complete SS7 or SIGTRAN stack for the most cost-effective solution for infrastructure developers in converged and Next Generation Network environments.

Next Generation Network applications
The density of the HDCIII and its ability to run high volumes of network traffic make it perfect for narrowband signaling between 3G SGSNs and HLR/VLR and MSCs in the Core Network. The high density (8 trunks or 248 MTP2 links) of the HDCIII card, coupled with its superb performance for large numbers of small transactions (as is common in Telecom transaction operations) means that it is particularly appropriaten for HLRs that need to support an increasing number of subscribers.

Signaling Blade
Multiple HDCIII modules can be mounted onto a cPCI or ATCA SBC and configured as a signaling blade. Resulting in a powerful, high density single slot solution for SS7, SIGTRAN or SS7/IP signaling. With the ability to run a signaling stack or gateway on one card, the signaling blade enables an extremely cost-effective solution. This signaling blade can support a complete SS7 stack over T1/E1/J1 interfaces
and/or SIGTRAN protocols over Ethernet ports, which provide the SS7 transport over IP. This enables the simple and straightforward integration of existing SS7 Intelligent Nodes and databases with IP based Media Gateways, Signaling Gateways and Softswitches.

Example Application Areas:

• Signaling Gateways
• Media Gateway Controllers
• SGSN, GGSN, MSC, HLR, VLR and BSS Nodes
• VAS Applications such as SMS, Roaming and Billing
• Test and Measurement applications
• Simulation and Monitoring Systems

Technical Specifications

Protocol Support

• SS7 MTP2: ITU-T Q.703, ETSI 300 008, 300 008-1, ANSI T1.111, TTC JTQ. 703, ITU Q.703 Annex A 1996, China SS7 YD/T 1125 - 2001
• Broadband SS7 ATM AAL5: ITU-T Q.2110 SSCOP, ITU-T Q.2130/Q.2140 SSCF
• SS7 MTP3: ITU-T Q.704, Q.707, ETSI 300 008, 300 008-1, ANSI T1.111, Bellcore GR246, GR606, GR82
• SS7 MTP signaling performance ITU-T Q.706
• LAPB/D: Q.921, TR 41449, TR 62411
• LAPF: Q.922
• LAPV5
• HDLC
• X.25: CCITT 1980, 1984 and 1988
• Frame Relay/PPP: T1.606, T1.617, T1.618, Q.922, Q.933, RFC1293, RFC2427
• M3UA: RFC RFC 4666 • M2PA: drafts 6-13/RFC4165
• SCTP: RFC 2960, RFC 3309 • M2UA: RFC 3331
• Passing of PCM voice traffic according to G.711
• Up to 256 channels of one of the above or a combination of multiple protocols per board.

Interfaces

• T1: ANSI T1.102, T1.403, AT&T TR62-411 Bellcore TR-TSY-000170
• E1: ITU G.703, G.704 and G.705 including CRC4, ETSI TBR 12 and 13
• J1: ITU TTC JT-G.704, including alternate CRC-6 calculation for Japanese applications, and detection of the “Japanese Yellow” alarm
• 8 E1/T1/J1 interfaces (software selectable) per HDC card
• High impedance ports in accordance with G.772

Power Requirements

PMC

• 6-10 watts typical-maximum power consumption

  PCI/PCIe

• 7-12 watts typical-maximum power consumption

  AMC

• 8-14 watts typical-maximum power consumption

Compliancy

PMC

• PCI Mezzanine Card (PMC) IEE P1386.1
• PCI Specification Revision 2.2
• PMC on CompactPCI Specification PICMG 2.3 R1.0
• CompactPCI PCI Telecom Mezzanine card specificationPICMG 2.15

PCI/PCIe

• PCI Specification Revision 2.3
• PCI Express Electromechanical Specification Revision 1.1

AMC

• PICMG AMC.0 Specification R2.0, mid-size and full-size
• PICMG AMC.1 PCI Express and Advanced Switching R1.0
• PICMG AMC.2 Gigabit Ethernet R1.x
• PICMG AMC.3 Storage Interfaces R1.x
• IPMI Intelligent Platform Management Interface Specifications, V1.5

Designed to meet:

• EMC Directive 89/336/EEC, EN 55022, EN55024 (Europe)
• EN 300 386
• FCC 47 CFR Part 15, Subpart B (USA)
• CISPR22
• VCCI (Voluntary Japan Electromagnetic Compatibility requirement)
• UL 60950, 3rd edition (US and Canada)
• LVD 73/23EEC (Europe)
• Denen Law (Japan Safety)

AMC System Interconnect

• PCI Express:
  • One x4 PCI Express Interface.
  • AMC fat pipes region port 4-7 (root complex)
• Gigabit Ethernet:
  • Two Gigabit Ethernet 1000Base-BXZ (SerDes) ports AMC common options region port 0-1.

AMC Front Panel Interfaces

• LEDs:
  • Standard AMC
  • LED 0 (blue) Hot Swap
  • LED 1 (amber)
  • Four trunk status LEDs
  • One board status LED

Temperature Range

PMC - 5°C to + 50°C
PCI, PCIe, AMC - 5°C to + 55°C

Board Dimensions

PMC – 14.9 cm x 7.4 cm
PCI – 10.67 cm x 17.46 cm
PCIe – 11.11 cm x 16.77 cm
AMC – 18.2 cm x 7.4 cm

All specifications are subject to change without notice.